Thermal Processing is a vital step of semiconductor manufacturing and research.
Thermal equipment span from Atmospheric Diffusion, Oxidation, Annealing and Low Pressure Vacuum Deposition of thin and thick layers depending on the process step and needs.
Rapid Thermal Process and Annealing is also widely used by heating silicon wafers to high temperatures (over 1,000 °C) on a timescale of several seconds or less for the purpose of dopant activation, thermal oxidation, metal reflow, densify deposited films, change states of grown films, repair damage from ion implantation and more.

Thermal / Vacuum Deposition

Diffusion / Oxidation / VCVD

RTP

ALD

MBE

PLD

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