Thermal and Vacuum Deposition processes are vital steps of semiconductor manufacturing and research.
Thermal equipment span from Atmospheric Diffusion, Oxidation, Annealing and Low Pressure Vacuum Deposition of thin and thick layers depending on the process step and needs.
Rapid Thermal Process and Annealing is also widely used by heating silicon wafers to high temperatures (over 1,000 °C) on a timescale of several seconds or less.
MOCVD (metal organic chemical vapour deposition) is a technology that is used to deposit very thin layers of atoms onto a semiconductor wafer. It is the most significant manufacturing process for III-V compound semiconductors, especially for those based on Gallium Nitride (GaN).