The XTEM Prep Kit makes it easy to stack and bond together rectangular wafers obtained from the area of interest of the bulk material. A vise assembly holds the wafers in place while the vacuum-compatible epoxy is curing. The wafer stack is subsequently cored and sectioned into disk specimens. The XTEM Prep Kit produces specimens with a high level of mechanical integrity and a consistent glue layer thickness. The kit includes all components needed to produce high-quality, cross-section specimens.