The 3D SEM imaging solution for chip design recovery,
layout reconstruction, anti-counterfeiting, IP protection and brain mapping
Large-area, ultra-high-resolution 3D SEM imaging
applications in chip reverse engineering, materials science, and life sciences (e.g. connectomics), require surfaces of up
to cm² areas to be scanned with nm resolution and excellent layer to layer accuracy (‘3D stitching’) for layout and schematic extraction or 3D modeling. While traditional SEM instruments are inherently limited by small, uncalibrated fields of view (FOVs) and imprecise sample positioning, CHIPSCANNER addresses these challenges by combining the resolution and flexibility of an SEM instrument with the accuracy, stability, and automation of an electron beam lithography (EBL) instrument.