Acoustic Micro Imaging AMI’s outstanding benefit is its ability to find hidden defects within assemblies and materials that can occur during manufacturing or environmental testing. Defects such as delaminations, voids and cracks can be identified and analyzed more effectively using AMI than with any other inspection method. Unlike other non-destructive techniques such as X-Ray and Infrared Imaging, AMI is highly sensitive to the elastic properties of the materials it travels through. Because of this, the ability of AMI to find and characterize these physical defects is clearly superior.
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